From HP:
Thermal Cycling and Mechanical Cavitation
The thin-film heater resistors used in the integrated driver
printhead are subjected to severe mechanical stresses during operation. These stresses arise from thermal cycling of
the resistors and cavitation forces as the vapor bubbles collapse on various surfaces within the firing chambers. The
thin-film resistor material is heated from near ambient temperature to well above the superheat temperature of water
(the principal solvent in HP thermal inkjet inks) within several microseconds by each firing pulse. This results in large
cyclic temperature gradients within the thin-film stack, in both the vertical and lateral directions. Thermal cycling to
this extent creates extremely large mechanical stresses and therefore imposes a number of constraints on the thin-film
materials used. In addition to chemical compatibility and thermal stability, the films above and below the resistor film
must have stable, well-matched, film stresses to prevent cracking or delamination during operation.
During the cooling phase of each drop ejection cycle, the drive bubble collapses, allowing refill of the firing chamber
with ink. While seemingly benign, the bubble collapse can create a microjet of fluid which causes large localized pressures on the surface it impacts. This process, known as cavitation, is difficult to observe directly, but it does produce pressures in excess of 130 atmospheres. If the firing chamber is incorrectly configured, these cavitation events can
peen the protective films over the resistor and actually chip away portions of the film. Once damaged, the nucleation of
subsequent bubbles is altered. If severe enough, this damage initiates a chain of events that can cause the resistor to
break open and fail.
More at
http://www.hpl.hp.com/hpjournal/94feb/feb94a6.pdf
These mechanical stresses, which are unique to thermal inkjet technology, impose constraints on the integrated circuit chip in the integrated driver printhead, since the drive
transistors share several films with the thermal inkjet portion of the device.
ALSO from other sources...
"The failures presented in this work showed three primary factors influencing the failure modes and lifetime of printhead; bubble cavitation damage, thermal fatigue, and electromigration of heater".